Since the mainstream of the memory chip package is shifting to BGA package from TSOP, it becomes more difficult to do rework or repair on defective devices. Compared to TSOP package, BGA package's soldering points,a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well as touch up rework. The only possible way to rework/repair already processed BGA package on board is detaching it from board. However, once it is removed from the board then its solder balls are damaged and cannot be used unless damaged balls are replaced.

POLYSTAK offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one.

Click here for BGA Reballing Brochure