3D Memory Stacking
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By stacking two or more memory chips, POLYSTAK effectively produces single memory components with significant advantages over single-chip devices of comparable density. The three of most prominent advantages are:
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availability in high volume before the same-density, single-chip solution comes to market
cost effectiveness until the same-density monolithic device drops to price parity
significant space saving via 3D structure |
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Rework/
Repair
POLYSTAK currently provides Rework/Repair services to major semiconductors with the range of services from pre-diagnosis and rework/repair to testing those refurbished products in both module and component level. |
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BGA Reballing
As the majority of devices adopt BGA packages and lead-free process becomes mandatory, the electronic manufacturing service industry produces more defectives compared to when they use TSOP packages and conventional process with Pb base materials. |
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POLYSTAK offers cost effective BGA Reballing service that makes damaged BGA packaged parts turn into like new condition.
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